Insights into Tungsten Chemical Mechanical Planarization: Part III. Mini-Marathons and Associated Numerical Simulations
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Steigerwald J. Murarka S. Gutmann R. , Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, 2008.
2. Chemical mechanical planarization for microelectronics applications
3. A Novel Optical Technique to Measure Pad-Wafer Contact Area in Chemical Mechanical Planarization
4. Erratum: Synthesis of Pt/TiO2 Nanotube Catalysts for Cathodic Oxygen Reduction [J. Electrochem. Soc., 155, B915 (2008)]
5. CMP Pad Break-in Time Reduction in Silicon Wafer Polishing
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