Author:
Lin Bin,Li Zhichao,Sun Wangping,Zhang Xiaohong
Abstract
Simultaneous double side grinding (SDSG) is one of the state-of-art processes to flatten silicon wafers. This paper presents an overview of current research on SDSG of silicon wafers, which includes process applications, process modeling, and possible topics for future research.
Publisher
The Electrochemical Society
Cited by
2 articles.
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