Probing the Mechanism of Electroless Gold Plating Using an EQCM: II. Effect of Bath Additives on Interfacial Plating Processes-Reference-Cited by-同舟云学术

Probing the Mechanism of Electroless Gold Plating Using an EQCM: II. Effect of Bath Additives on Interfacial Plating Processes

Published:2001 Issue:6 Volume:148 Page:C413
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Sargent Anita,Sadik Omowunmi A.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference26 articles.

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3. E. R. Nolan, D. C. Duane, T. H. Herder, T. A. Bishop, K. T. Tran, R. W. Froehlich, R. L. German, R. D. Nelson, C. J. Lee, M. R. Breen, and K. V. Keswick, U.S. Pat. 5,508,228 (1996).

4. C. H. Ting and M. Paunovic, U.S. Pat. 5,169,680 (1992).

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