Author:
Gasquères C.,Duminica F.-D.,Maury F.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Diffusion barriers in thin films
2. E. Blanquet, B. Chenevier, E. Ramberg, C. Bernard, and R. Madar , inCVD XVI and EUROCVD 14, M. Allendorf , F. Maury , and F. Teyssandier , Editors, PV 2003-08, p. 1212, The Electrochemical Society Proceedings Series, Pennington, NJ (2003).
3. C. Gasqueres and F. Maury , inTrends in Vacuum Science & Technology, Vol. 6, pp. 109–126, Research Trends, Trivandrum, India (2004).
4. Thermal stability of copper interconnects fabricated by dry-etching process
5. The Processing Windows for Selective Copper Chemical Vapor Deposition from Cu(hexafluoroacetylacetonate)trimethylvinylsilane
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献