Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Cited by
7 articles.
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1. Extreamly Advanced Cu Interconnect with Selective ALD Barrier for High Performance Logic Device;2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM);2023-05
2. Galvanic Corrosion Effect of Co Liner on ALD TaN Barrier;2022 IEEE International Interconnect Technology Conference (IITC);2022-06-27
3. Stoichiometry tuning of TaN films through ion treatment: Molecular dynamics study;Journal of Vacuum Science & Technology A;2021-12
4. CMP Development for Ru Liner Structures beyond 14nm;ECS Journal of Solid State Science and Technology;2018
5. Barrier properties of ultrathin VN films of low resistivity and high density for Cu interconnects;Japanese Journal of Applied Physics;2016-01-05