Simulation of Electroless Deposition of Cu Thin Films for Very Large Scale Integration Metallization-Reference-Cited by-同舟云学术

Simulation of Electroless Deposition of Cu Thin Films for Very Large Scale Integration Metallization

Published:1997-06-01 Issue:6 Volume:144 Page:2115-2122
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Smy T.¹²³,Tan L.¹²³,Dew S. K.¹²³,Brett M. J.¹²³,Shacham‐Diamand Y.¹²³,Desilva M.¹²³

Affiliation:

1. Department of Electronics, Carleton University, Ottawa, Ontario, Canada K1S 5B6

2. Department of Electrical Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G7

3. School of Electrical Engineering, Cornell University, Ithaca, New York 14850

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1837750/pdf

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