Investigation of Electroless Co(W,P) Thin Film as the Diffusion Barrier of Underbump Metallurgy-Reference-Cited by-同舟云学术

Investigation of Electroless Co(W,P) Thin Film as the Diffusion Barrier of Underbump Metallurgy

Published:2008 Issue:5 Volume:155 Page:D369
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Wu W. C.,Hsieh Tsung-Eong,Pan Hung-Chun

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. Diffusion barriers in thin films

2. R. H. Uang, K. C. Chen, S. W. Lu, H. T. Hu, and S. H. Huang ,IEEE Electron. Packag. Technol. Conf., Singapore, Dec. 5–7, p. 292, IEEE, Piscataway, NJ (2000).

3. Electroless Copper/Nickel Films Deposited on AlN Substrates

4. T. Oppert, E. Zakel, and T. Teutsch ,Proc. IEMT/IMC Symp., Japan, April 15–17, p. 106, IMPAS/IEEE, CPMT JAPAN (1998).

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