Improvement in Leakage Current and Breakdown Field of Cu-Comb Capacitor Using a Silicon Oxycarbide Dielectric Barrier-Reference-Cited by-同舟云学术

Improvement in Leakage Current and Breakdown Field of Cu-Comb Capacitor Using a Silicon Oxycarbide Dielectric Barrier

Published:2004 Issue:9 Volume:151 Page:G606
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Chiang Chiu-Chih,Ko I-Hsiu,Chen Mao-Chieh,Wu Zhen-Cheng,Lu Yung-Cheng,Jang Syun-Ming,Liang Mong-Song

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. A comparative study of copper drift diffusion in plasma deposited a-SiC:H and silicon nitride

2. K. Goto, H. Yuasa, A. Andatsu, and M. Matsuura, inProceedings of IEEE 2003 IITC, p. 6 (2003).

3. M. Fayolle, J. Torres, G. Passemard, F. Fusalba, G. Fanget, D. Louis, L. Arnaud, V. Girault, J. Cluzel, H. Feldis, M. Rivoire, O. Louveau, T. Mourier, and L. Broussous, inProceedings of IEEE 2002 IITC, p. 39 (2002).

4. J. Martin, S. Filipiak, T. Stephens, F. Huang, M. Aminpur, J. Mueller, E. Demircan, L. Zhao, J. Werking, C. Goldberg, S. Park, T. Sparks, and C. Esber, inProceedings of IEEE 2002 IITC, p. 42 (2002).

5. T. Ishimaru, Y. Shioya, H. Ikakura, M. Nozawa, Y. Nishimoto, S. Ohgawara, and K. Maeda, inProceedings of IEEE 2001 IITC, p. 36 (2001).

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