Role of Surfactant Molecules in Post-CMP Cleaning-Reference-Cited by-同舟云学术

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Role of Surfactant Molecules in Post-CMP Cleaning

Published:2008 Issue:2 Volume:155 Page:H64
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Ng Dedy,Kundu Subrata,Kulkarni Milind,Liang Hong

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Minimization of Particle Contamination during Wet Processing of Si Wafers

2. M. L. Free and D. O. Shah ,Micro, pp. 29–37, Canon Communications, Inc., Los Angeles, CA (May 1998).

3. Chemical mechanical planarization for microelectronics applications

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Effect of Surfactants on the Removal of Ceria Particles in the Buff Clean Process;ECS Journal of Solid State Science and Technology;2023-08-31

2. Design of “Soft” Cleaning Processes for Emerging Substrates via Stimuli Responsive Chemistry;Solid State Phenomena;2023-08-14

3. Approaches to defect characterization, mitigation and reduction;Advances in Chemical Mechanical Planarization (CMP);2022

4. Particle Removal by Surfactants During Semiconductor Cleaning;Surfactants in Precision Cleaning;2022

5. Removal of Nanoceria Abrasive Particles by Using Diluted SC1 and Non-Ionic Surfactant;ECS Journal of Solid State Science and Technology;2021-03-01

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