Scaled Micro-Relay Structure with Low Strain Gradient for Reduced Operating Voltage

Abstract

A relatively thin structural film with low strain gradient is developed for micro-relay technology. Relays fabricated using this film as the structural material operate with relatively low pull-in voltage and hysteresis, which is desirable for achieving low-power and high-endurance relay integrated circuits. With the improved structural film, relays with scaled layout dimensions are demonstrated for the first time.