(Invited) From MEMS-CMOS towards Heterogeneous Integration over Scale

Abstract

Micromachining technology has created a great variety of micro/nanoelectromechanical systems (MEMS/NEMS) through the integration of moving mechanisms, sensors, and electronics in a chip-size system. Integration of CMOS circuitry and MEMS technology improves the performance of micro sensors and actuators, programmability, miniaturization and simplicity of total device packaging. It is expected that MEMS-CMOS technology enables a more-than-Moore solution for the next-generation electronics. Such heterogeneous integration will be expanded over scale and material. Organic and inorganic chemistry as well as bio technology can provide functional materials for sensing, energy conversion and actuation. Printing can be an inexpensive way to have micro patterns on a meter-size substrate or film. The concept and examples of heterogeneous integration are discussed.