Abstract
Cu ion release due to corrosion plays a critical role in the antimicrobial efficacy of Cu. There are, however, concerns regarding surface passivation, and thus, decreased Cu ion release after routine cleaning with hospital-grade disinfectants. In this study, immersion corrosion rate measurements up to 7 d coupled with SEM and XPS were employed to evaluate the corrosion behavior of pure Cu in 0.5% H2O2 and two commercially available hospital-grade H2O2-based disinfectants. Results show considerably higher corrosion rates in the commercially-available cleansers compared to H2O2 alone, meaning that Cu ion release occurs readily during routine disinfection with these products.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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