Electrodeposition of Nickel-Tungsten Alloy with Functional Concentration Periodically Graded Material Structure for Low Stress and High Hardness

Author:

Park SoobinORCID,Han Haneul,Seo JinmyeongORCID,Park Jungjoon,Yoon SanghwaORCID,Yoo Bongyoung

Abstract

A nickel-tungsten alloy film was deposited using an electrodeposition process. The tungsten concentration in the nickel-tungsten alloy was controlled by the applied current density. The surface morphology, micro-structure, internal stress, and hardness were characterized as a single-layer structure. Hardness increased as the tungsten content increased, but micro-cracks occurred on the surface. A multi-layered structure was selected to increase the hardness without micro-cracks. The multi-layered nickel-tungsten alloy film was deposited to form two types: functional periodic materials and functional graded materials. These multi-layered structures were deposited by changing the applied current density periodically and gradually, respectively, during the deposition process. The mechanical properties, such as internal stress and hardness of the nickel-tungsten alloy, were characterized as a function of the tungsten concentration of the nickel-tungsten alloy film. As the number of periods increased, the internal stress decreased, and micro-cracks were removed from the surface. However, the gradually varied nickel-tungsten alloy had higher internal stress than the periodically varied alloy. Similar hardness was observed because the concentration of nickel-tungsten film at the top of the multi-layered structure was the same. Overall, we demonstrated enhanced mechanical properties, including low internal stress and high hardness, of concentration periodically graded nickel-tungsten alloy.

Publisher

The Electrochemical Society

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