Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration

Published:2009 Issue:5 Volume:12 Page:D39
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Lühn O.,Radisic A.,Vereecken P. M.,Van Hoof C.,Ruythooren W.,Celis J.-P.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference13 articles.

1. E. Beyne , in Proc. of International Interconnect Technology Conference , San Francisco, CA, pp. 1–5 (2006).

2. An Investigation of the Mechanism of Levelling in Electrodeposition

3. Blocking Inhibitors in Cathodic Leveling: I. Theoretical Analysis

4. Blocking Inhibitors in Cathodic Leveling: II. Experimental Investigation

5. Superconformal Electrodeposition of Copper

Cited by 53 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of a Single-Component Additive for Bottom-Up Superfilling of the High-Aspect-Ratio TSV by Theoretical and Experimental Studies;The Journal of Physical Chemistry C;2024-06-15

2. A Novel Model for Copper Electroplating Process Simulation Minimizing Chemical Additives;International Journal of Precision Engineering and Manufacturing;2024-06-13

3. Effects of ethylenediamine tetrakis(ethoxylate-block-propoxylate) tetrol on tin electrodeposition;Electrochimica Acta;2022-07

4. Microfluidic Device for In Situ Observation of Bottom-Up Copper Electrodeposition in a TSV-Like Structure;Journal of The Electrochemical Society;2020-12-01

5. Superconformal Deposition;Surface and Interface Science;2020-01-17

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3