Cleaning Process in Single Wafer Tool: Impact of Dispersion Phenomena on Rinsing Time

Abstract

Silicon wafers fabrication involves many wet processes in which liquids are distributed across the wafer surface. In single wafer tools, the fluid dispense is crucial and determines how homogeneous the cleaning process will be achieved. The fluid dynamics and chemical transport in the rinsing flow are studied and it is shown that dispersion phenomena in the radial direction due to non homogeneous velocities across the fluid layer have to be taken into account in the general analysis of rinsing time.