Investigation of Diamond Films Polished by Thermal Chemical Mechanical Polishing

Abstract

In this paper, CVD diamond films were planarized by thermal chemical mechanical polishing, in which two steps polishing methods (first polishing and final polishing) to diamond films were optimized. In the first polishing process, Al2O3 abrasives with particle size of 14μm were chosen to remove the rough surface of the diamond films. In the final polishing process, three kinds of polishing experiments containing different abrasives were compared. The experiment results demonstrated that the slurry with mixture abrasives and KMnO4 oxidant at the high temperature can improve the diamond films surface morphology effectively. As a result, the surface roughness was reduced from 280nm to 27.2nm, and the removal rate was up to 1.21μm /h.