Characterization of Silicon Wafer Back Sides with Low Thermal Oxide Layers by Copper Deposition
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Published:2000
Issue:8
Volume:147
Page:3081
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ISSN:0013-4651
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Container-title:Journal of The Electrochemical Society
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language:en
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Short-container-title:J. Electrochem. Soc.
Author:
Schmolke R.,Puppe G.,Piontek H.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials