Cleaning and Damage Performance of Single Wafer Cleaning Tools using Physical Removal Forces

Abstract

The aim of this study was to evaluate the trade off between damage generation and particle removal of single wafer cleaning tools that apply a physical force. We looked at 30 nm silica removal and damage of ~ 20 nm wide amorphous-Si lines caused by aerosol spray cleaning or acoustic cleaning. A detailed calculation of local particle removal rates and local damage fluxes gives important information about cleaning (non-) uniformities. Average removal rates and average damage fluxes values were also obtained and give valuable about the cleaning versus damage trade-off.