Formation Factor of Nodule by Copper Electrodeposition

Abstract

Copper electrodeposition has been used in the formation of the signal line in cellular phones, liquid crystal TVs and digital cameras. Recently, the formation of nodules and large knot deposits became a serious problem because of the downsizing of signal lines pitch in electronic devices. The nodules cause short circuits in the signal lines. In our previous work, we have investigated the origins of the nodules formation. The nodules grow as the growth of the copper electrodeposits and tiny hemispherical deposits are the nucleuses of the nodules. However, numerous unknown factors remain, such as the formation mechanism of the nodules nucleuses. In this report, we further discuss the factors of the nodule formation.