Decoupling of Ion Diffusivity and Electromobility in Porous Dielectrics

Author:

Fan Ye,Ali Rizwan,King Sean W.,Bielefeld Jeff,Orlowski Marius K

Abstract

Porous back-end dielectric materials with porosity from 8% to 25%, sandwiched between Cu and W/Pt electrodes, have been investigated in terms of Cu diffusivity and mobility. In nonporous materials the diffusivity D and mobility m of charged particles such as an ion is related by the Einstein relation: μ=D q/kT. Here, we present evidence that in porous materials the diffusivity and mobility are decoupled on a global scale, even though the Einstein relation still holds locally. In porous materials, the voids lying in the path of the ion present an impenetrable barrier for ion migration. Voids can be only overcome by a detour around the obstacle by virtue of diffusion. We propose a modified relation between diffusivity and mobility in porous materials by μ=fp∙D q/kT where a porosity-tortuosity factor fp <1 is introduced. The factor fp depends on porosity and tortuosity of the porous material.

Publisher

The Electrochemical Society

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Effect of Post-Annealing on Reliability of Cu/Low-k Interconnects;ECS Journal of Solid State Science and Technology;2020-05-18

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