Bottom-Up Fill of Copper in Deep Submicrometer Holes by Electroless Plating-Reference-Cited by-同舟云学术

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Bottom-Up Fill of Copper in Deep Submicrometer Holes by Electroless Plating

Published:2004 Issue:6 Volume:7 Page:C78
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Shingubara Shoso,Wang Zengling,Yaegashi Osamu,Obata Ryo,Sakaue Hiroyuki,Takahagi Takayuki

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference29 articles.

1. Damascene copper electroplating for chip interconnections

2. Superconformal Electrodeposition of Copper in 500–90 nm Features

3. Benzotriazole as an Additive for Copper Electrodeposition Influence of Triazole Ring Substitution

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1. A Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process on Aluminum Alloys at Medium and Low Temperatures;Journal of The Electrochemical Society;2024-07-01

2. Electroless Plating of Ru Using Hydrazine Hydrate as a Reducing Agent;Journal of Electronic Materials;2023-07-26

3. Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte;Journal of The Electrochemical Society;2022-09-01

4. Research Progress of Electroless Plating Technology in Chip Manufacturing;Acta Chimica Sinica;2022

5. Conformal Electroless Deposition of Barrier and Cu Seed Layers for Realizing All-Wet TSV Filling Process;ECS Transactions;2019-12-17

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