Electrochemical Behavior of Tin and Silver during the Electrorecycling of Pb-free Solder (Sn-Ag-Cu) Waste-Reference-Cited by-同舟云学术

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Electrochemical Behavior of Tin and Silver during the Electrorecycling of Pb-free Solder (Sn-Ag-Cu) Waste

Published:2022-06-30 Issue:3 Volume:31 Page:61-72
ISSN:2765-3439
Container-title:Resources Recycling
language:en
Short-container-title:Resour. Recycl.

Author:

Kim Min-seuk^ORCID,Lee Jae-chun^ORCID,Kim Rina^ORCID,Chung Kyeong-woo^ORCID

Publisher

The Korean Institute of Resources Recycling

Link

http://j-kirr.or.kr/articles/pdf/doi/10.7844/kirr.2022.31.3.61.pdf

Reference19 articles.

1. Jae-chun Lee, Jinki Jeong, Byung-su Kim, et. al., 2010 : Development of Technology for the Recycling of Urban Ore, Korea Institute of Geoscience and Mineral Resources, pp.31.

2. Ministry of Environment, http://www.me.go.kr/wonju/web/board/read.do?menuId=1032&boardMasterId=232&boardCategoryId=305&boardId=293348, June 14, 2022.

3. A review: On the development of low melting temperature Pb-free solders

4. H. Takahashi, T. Tanaka, M. Hamada, et. al., 2009 : Novel Recycle System of Solder Paste, 10th Int. Symp. on East Asian Res. Recycl. Tech., pp.761-764.

5. A Novel Cyclic Process Involving Zinc for Separating Silver from Lead-Free Solder Residue

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Current Status and Securing Strategies of tin Resources for Future Core Industries;Journal of the Korean Society of Mineral and Energy Resources Engineers;2022-08-31

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