Reliability-based Design Optimization (RBDO) Study Applied to the Thermal Management of a Multi-Led Chip Package

Abstract

Solid-state lighting based on LEDs is used in various applications, including display, communications, etc. However, the high junction temperature is still challenging due to the LED chip’s reduced light output and lifetime. To face this challenge, a thermal study was done to determine junction temperature TJ of a multi-led chip package. Then, a sensitivity analysis of different materials was performed using the Sobol method to identify the parameters that most influence the junction temperature. To calculate the probability of failure of the model, the FORM-SORM and Monte Carlo methodologies were employed in this study. It was obtained that the probability of failure of the LED package is roughly 20%. An optimum design was created using reliability-based design optimization (RBDO) to lower this percentage. After application of this method, the junction temperature was lowered by 11% and the reliability level increased from 80% to 91%.