Reliability Evaluation of Cyclic Thermal Stress Test Using Aluminum Chip Embedded Epoxy Resin Model.
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Published:1994
Issue:495
Volume:43
Page:1615-1621
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ISSN:1880-7488
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Container-title:Journal of the Society of Materials Science, Japan
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language:
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Short-container-title:Journal of the Society of Materials Science, Japan
Author:
HOJO Hidemitsu,KUBOUCHI Masatoshi,TSUDA Ken,OHTOMO Yasuji
Publisher
Society of Materials Science, Japan
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
1 articles.
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