Microstructure and Residual Stress of EB-PVD TBCs Grown under Substrate Rotation-Reference-Cited by-同舟云学术

Microstructure and Residual Stress of EB-PVD TBCs Grown under Substrate Rotation

Published:2008 Issue:7 Volume:57 Page:674-680
ISSN:0514-5163
Container-title:Journal of the Society of Materials Science, Japan
language:en
Short-container-title:J. Soc. Mat. Sci., Japan

Author:

SUZUKI Kenji¹,SHOBU Takahisa²,WADA Kunihiko³,MATSUBARA Hideaki⁴,KAWAMURA Masashi⁵

Affiliation:

1. Dept. of Tech. and Living Sci., Niigata Univ.

2. Japan Atomic Energy Agency

3. Power and Industrial Systems Res. and Dept. Center, Toshiba, Ltd.

4. Japan Fine Ceramics Center

5. Technical Inst., Kawasaki Heavy Industries, Ltd.

Publisher

Society of Materials Science, Japan

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/jsms/57/7/57_7_674/_pdf

Reference13 articles.

1. 1) K. Suzuki, K. Matsumoto, T. Kubo, S. Machiya, K. Tanaka and Y. Akiniwa, “Analysis on residual stress in electron beam-physical vapor deposited thermal barrier coating using hard synchrotron X-rays”, Transaction of the Japan Society of Mechanical Engineers, Ser. A, Vol.71, No.711, pp.1523-1529 (2005).

2. 2) K. Suzuki, K. Wada, H. Matsubara, T. Shobu, M. Kawamura and K. Tanaka, “Residual Stress in Zirconia Coating by EB-PVD Method”, Journal of the Society of Material Science, Japan, Vol.56, No.7, pp.588-593 (2007).

3. 3) X. Zhao, X. Wang and P. Xiao, “Sintering and failure behaviour of EB-PVD thermal barrier coating after isothermal treatment”, Surface & Coating Technology, Vol.200, pp.5946-5955 (2006).

4. 4) S. Sridharan, L. Xie, E. H. Jordan and M. Gell, “Stress variation with thermal cycling in the thermally grown oxide of an EB-PVD thermal barrier coating”, Surface & Coatings Technology, Vol.179, pp.256-296 (2004).

5. 5) V. K. Tolpygo and D. R. Clarke, “Morphological evolution of thermal barrier coatings induced by cyclic oxidation”, Surface & Coatings Technology, Vol.163-164, pp.81-86 (2003).

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