Application of Wood-Utilized Synthesized Copper-Based Particle for the Improvement of Wear Resistance of Epoxy Resin
Author:
Affiliation:
1. Department of Mechanical Engineering, Graduate School of Engineering, University of Hyogo
2. Graduate School of Natural Science and Technology, Okayama University
Publisher
Japanese Society of Tribologists
Subject
Surfaces, Coatings and Films
Link
https://www.jstage.jst.go.jp/article/trol/15/5/15_388/_pdf
Reference32 articles.
1. [1] Lin, F., Bhatia, G. S. and Ford, J. D., “Thermal Conductivities of Powder-Filled Epoxy Resins,” Journal of Applied Polymer Science, 49, 11, 1993, 1901–1908.
2. [2] Guo, Z., Liang, X., Pereira, T., Scaffaro, R. and Thomas Hahn, H., “CuO Nanoparticle Filled Vinyl-Ester Resin Nanocomposites: Fabrication, Characterization and Property Analysis,” Composites Science and Technology, 67, 10, 2007, 2036–2044.
3. [3] Mochalin, V. N., Neitzel, I., Etzold, B. J. M., Peterson, A., Palmese, G. and Gogotsi, Y., “Covalent Incorporation of Aminated Nanodiamond into an Epoxy Polymer Network,” ACS Nano, 5, 9, 2011, 7494–7502.
4. [4] Briscoe, B. J., Pogosian, A. K. and Tabor, D., “The Friction and Wear of High Density Polythene: The Action of Lead Oxide and Copper Oxide Fillers,” Wear, 27, 1, 1974, 19–34.
5. [5] Bahadur, S. and Gong, D., “The Role of Copper Compounds as Fillers in the Transfer and Wear Behavior of Polyetheretherketone,” Wear, 154, 1, 1992, 151–165.
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