Toward a Digital Design Framework for the Thermal Tunability of 3D Printed Envelopes
Author:
Affiliation:
1. CASE, School of Architecture, Rensselaer Polytechnic Institute, Brooklyn, New York, USA.
2. Material Science and Engineering, Rensselaer Polytechnic Institute, Brooklyn, New York, USA.
Publisher
Mary Ann Liebert Inc
Link
https://www.liebertpub.com/doi/pdf/10.1089/3dp.2023.0356
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5. Functionally Graded Structures through Building Manufacturing
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