Effects of the Mechanical Properties of Collagen Gel on the In Vitro Formation of Microvessel Networks by Endothelial Cells
Author:
Affiliation:
1. Department of System Design Engineering, Keio University, Yokohama, Japan.
Publisher
Mary Ann Liebert Inc
Subject
General Engineering
Link
https://www.liebertpub.com/doi/pdf/10.1089/ten.2006.0333
Reference32 articles.
1. Tissue Engineering--Current Challenges and Expanding Opportunities
2. Engineering vascularized tissue
3. Reconstruction of 3D stacked‐up structures by rat small hepatocytes on microporous membranes
4. Fabrication of Pulsatile Cardiac Tissue Grafts Using a Novel 3-Dimensional Cell Sheet Manipulation Technique and Temperature-Responsive Cell Culture Surfaces
5. A New Method for Manufacturing Cardiac Cell Sheets Using Fibrin-Coated Dishes and Its Electrophysiological Studies by Optical Mapping
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