Fine-Pitch Solder on Pad Process for Microbump Interconnection
Author:
Publisher
Wiley
Subject
Electrical and Electronic Engineering,General Computer Science,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects
2. Novel Maskless Bumping for 3D Integration
3. Novel Bumping Material for Solder-on-Pad Technology
4. Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive
5. Novel Bumping and Underfill Technologies for 3D IC Integration
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