Research of the thermal interface of LED lighting sources by thermal relaxation differential spectrometry (TRDS)-Reference-Cited by-同舟云学术

Research of the thermal interface of LED lighting sources by thermal relaxation differential spectrometry (TRDS)

Published:2021-12-28 Issue:4 Volume:9 Page:181-192
ISSN:2335-2124
Container-title:Journal of Measurements in Engineering
language:
Short-container-title:J. meas. eng.

Author:

Vėžys J.,Aliakseyeu Yu,Bumai Yu,Vaskou A.,Niss V.,Minchenya V.

Publisher

JVE International Ltd.

Subject

Mechanical Engineering,Instrumentation,Materials Science (miscellaneous)

Link

https://www.jvejournals.com/article/21826/pdf

Reference18 articles.

1. A. L. Zakgeim, A. E. Chernyakov, A. S. Vaskou, V. K. Kononenko, and V. S. Niss, “Comparative analysis of the thermal resistance profiles of power light-emitting diodes cree and rebel types,” in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr. 2013, https://doi.org/10.1109/eurosime.2013.6529922

2. Yu. A. Bumai, A. S. Vaskou, V. K. Kononenko and V. M. Lomako, “Relaxation impedance spectrometer of thermal processes,” Electron. info, Vol. 3, pp. 58–59, 2010.

3. G. Farkas et al., “Electric and thermal transient effects in high power optical devices,” in Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2004, https://doi.org/10.1109/stherm.2004.1291320

4. Shang-Ping Ying and Wei-Bo Shen, “Thermal analysis of high-power multichip COB light-emitting diodes with different chip sizes,” IEEE Transactions on Electron Devices, Vol. 62, No. 3, pp. 896–901, Mar. 2015, https://doi.org/10.1109/ted.2015.2390255

5. P. Anithambigai, D. Mutharasu, T. Zahner, L. H. Huong, and D. Lacey, “A comparison study on thermal characterization of high power leds with different ceramic attach adhesives for automotive lighting applications,” in 2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep. 2014, https://doi.org/10.1109/therminic.2014.6972521