Diffusion Barrier Performance of thin Cr Films in the Cu/Cr/Si Structure-Reference-Cited by-同舟云学术

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Diffusion Barrier Performance of thin Cr Films in the Cu/Cr/Si Structure

Published:1999 Issue:1 Volume:T79 Page:228
ISSN:0031-8949
Container-title:Physica Scripta
language:en
Short-container-title:Physica Scripta

Author:

Ezer Y.,H?rk?nen J.,Arpiainen S.,Sokolov V.,Kuivalainen P.,Saarilahti J.,Kaitila J.

Publisher

IOP Publishing

Subject

Condensed Matter Physics,Mathematical Physics,Atomic and Molecular Physics, and Optics

Link

http://stacks.iop.org/1402-4896/1999/i=T79/a=053/pdf

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. The role of stress distribution at the film/barrier interface in formation of copper silicides;Semiconductors;2010-01

3. Electrochemical Deposition of Chromium Core−Shell Nanostructures on H−Si(100): Evolution of Spherical Nanoparticles to Uniform Thin Film without and with Atop Hexagonal Microrods;The Journal of Physical Chemistry C;2007-09-19

4. Production of evaporated tungsten foils on resistively heated substrates;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2006-05

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