Thermal Shock Behavior of the SiC-SiC Joints Joined with Na2O-B2O3-SiO2 Glass Solder-Reference-Cited by-同舟云学术

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Thermal Shock Behavior of the SiC-SiC Joints Joined with Na₂O-B₂O₃-SiO₂ Glass Solder

Published:2012-03-06 Issue:3 Volume:27 Page:234-238
ISSN:1000-324X
Container-title:Journal of Inorganic Materials
language:en
Short-container-title:Journal of Inorganic Materials

Author:

LUO Zhao-Hua,JIANG Dong-Liang,ZHANG Jing-Xian,LIN Qing-Ling,CHEN Zhong-Ming,HUANG Zheng-Ren

Publisher

China Science Publishing & Media Ltd.

Subject

Inorganic Chemistry,General Materials Science

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preparation of large-scale uniformly crystallized ITO thin films by rapid infrared annealing technique;Journal of Physics: Conference Series;2023-08-01

2. Recent advances in joining of SiC-based materials (monolithic SiC and SiCf/SiC composites): Joining processes, joint strength, and interfacial behavior;Journal of Advanced Ceramics;2019-03

3. Crystallization Behavior of Glass Ceramic Filler During Joining Process;Journal of Inorganic Materials;2015

4. Preparation of Ordered Porous Ceramic Joint on C/SiC Composites and Its Joining Technique;Journal of Inorganic Materials;2013-09-05

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