An integrated model for process parameter adjustment to recover throughput shortage in semiconductor assembly: A case study

Author:

Kok Hoe HoORCID,Prakash JoshuaORCID,Kamaruddin ShahrulORCID,Kok Seng OngORCID

Abstract

Purpose: Existing productivity improvements activities such as inventory buffer, overall equipment effectiveness (OEE) and total productive maintenance (TPM) do not analytically associate the throughput shortage with process parameters. The paper aims to develop and test an integrated model to recover the throughput shortage through process parameters adjustment in a semiconductor assembly.Design/methodology/approach: The mathematical model of planned throughput is developed as a function of input parameters in an integrated multiple process line. When the planned throughput does not meet the real-time throughput, the throughput shortage occurs. The planned throughput for the next day is summed with the throughput shortage from previous day and mathematical programming is used to find the optimum process parameter values. Findings: The throughput shortage is restored using mathematical programming for the subsequent day of planning. If there still exist throughput shortage, the additional throughput shortage will be carried forward for the subsequent day of planning where mathematical programming is used again to find the adjusted process parameters. The proposed optimization model in essentially a parametric model using input parameters of real-time data based on a normal distribution that is translated into a range of minimum and maximum using 95% confidence interval.Research limitations/implications: The adjusted input parameters in this model is based on the cycle time of three processes which are Die Attach, Wire Bond and Pre-Cap Inspection. Downtime and setup time are not subjected to adjustments.Practical implications: The mathematical programming computes optimum process parameters values to restore the throughput shortage where it correlates the process parameters and throughput shortage quantitatively rather than conventional method of throughput shortage recovery.Originality/value: The research addresses the process parameter adjustment to recover the throughput shortage in integrated multiple processes.

Publisher

Omnia Publisher SL

Subject

Industrial and Manufacturing Engineering,Strategy and Management

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3