Effects of Cu Wire's Shape on the Plating Property of Sn-Pb Solder for Photovoltaic Ribbons
-
Published:2014-08-25
Issue:4
Volume:15
Page:217-220
-
ISSN:1229-7607
-
Container-title:Transactions on Electrical and Electronic Materials
-
language:en
-
Short-container-title:Transactions on Electrical and Electronic Materials
Author:
Cho Tae-Sik,Chae Mun-Seok,Cho Chul-Sik
Publisher
The Korean Institute of Electrical and Electronic Material Engineers
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials