Crystallization Behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) Alloy Ribbons-Reference-Cited by-同舟云学术

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Crystallization Behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) Alloy Ribbons

Published:2011-02-28 Issue:1 Volume:12 Page:20-23
ISSN:1229-7607
Container-title:Transactions on Electrical and Electronic Materials
language:en
Short-container-title:Transactions on Electrical and Electronic Materials

Author:

Kim Min-Su,Jeon Young-Min,Im Yeon-Min,Lee Yong-Hee,Nam Tae-Hyun

Publisher

The Korean Institute of Electrical and Electronic Material Engineers

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://ocean.kisti.re.kr/downfile/crosscheck/kieeme/JAKO201108863880975.pdf

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Two-Way Shape Memory Effect in Rapidly-Quenched High-Copper TiNiCu Alloys Deformed in the Martensitic State;Russian Metallurgy (Metally);2020-04

2. Solidification Rate Dependence of Microstructures and Transformation Behavior of Ti–Ni–Hf Alloys;Journal of Nanoscience and Nanotechnology;2018-09-01

3. Crystallization and phase transformation behavior of TiCu-based bulk metallic glass composite with B2 particles;Journal of Alloys and Compounds;2017-06

4. Thermal Properties, Microstructure and Microhardness of Cu–Al–Co Shape Memory Alloy System;Transactions of the Indian Institute of Metals;2014-03-09

5. Effect of Sintering Temperature on the Structure and Piezoelectric Properties of Lead-Free 0.97K_0.5Na_0.5NbO₃-0.03AlFeO₃ Ceramics;Key Engineering Materials;2014-03

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