Publisher
Jan Evangelista Purkyne University in Usti nad Labem
Subject
Industrial and Manufacturing Engineering
Reference24 articles.
1. Effect of Germanium on Secondary Lead-free Tin Solders
2. Adhesive Bonding
3. Studium faktorů ovlivňujících pevnost lepených spojů (Study of factors influencing the bonded joint strength);BROŽEK;Strojárstvo/Strojírenství, Žilina, Media ST, 7,2003
Cited by
6 articles.
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