Fabrication of Flexible Sticker of Si Metasurfaces by a Transfer Process-Reference-Cited by-同舟云学术

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Fabrication of Flexible Sticker of Si Metasurfaces by a Transfer Process

Published:2022-02-15 Issue:2 Volume:69 Page:87-90
ISSN:0532-8799
Container-title:Journal of the Japan Society of Powder and Powder Metallurgy
language:en
Short-container-title:J. Jpn. Soc. Powder Powder Metallurgy

Author:

MURAI Shunsuke¹,INOUE Yuto¹,TANAKA Katsuhisa¹

Affiliation:

1. Department of Material Chemistry, Graduate School of Engineering, Kyoto University

Publisher

Japan Society of Powder and Powder Metallurgy

Subject

Materials Chemistry,Metals and Alloys,Industrial and Manufacturing Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/jjspm/69/2/69_87/_pdf

Reference24 articles.

1. 1) S. Zou, N. Janel, G. C. Schatz: J. Chem. Phys., 120 (2004) 10871.

2. 2) V. G. Kravets, F. Schedin, A. N. Grigorenko: Phys. Rev. Lett., 101 (2008) 087403.

3. 3) Y. Z. Chu, E. Schonbrun, T. Yang, K. B. Crozier: Appl Phys Lett Appl. Phys. Lett., 93 (2008) 181108.

4. 4) B. Auguie, W. L. Barnes: Phys. Rev. Lett., 101 (2008) 143902.

5. 5) Y. F. Yu, A. Y. Zhu, R. Paniagua-Domínguez, Y. H. Fu, B. Luk’yanchuk, A. I. Kuznetsov: Laser Photon. Rev., 9 (2015) 412.

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