Digital orthodontic indirect bonding systems: A new wave-Reference-Cited by-同舟云学术

Digital orthodontic indirect bonding systems: A new wave

Published:2020-09-18 Issue: Volume:10 Page:195-200
ISSN:2321-4600
Container-title:APOS Trends in Orthodontics
language:en
Short-container-title:APOS

Author:

Balut Nasib¹,Thakkar Digant P.²,Gonzalez Enrique³,Eluani Rodrigo⁴,Silva Luis David⁴

Affiliation:

1. Universidad de Baja California, Mexicali, Mexico,

2. Silver Smile Orthodontics, Digant’s 3D Orthodontics, Rajkot, Gujarat, India,

3. Universidad Tecnológica de Mexico, Mexico

4. Clinica Balut, Mexico,

Abstract

Digital technologies are progressing with leaps and bounds and the field of orthodontics is not untouched by it, with innovations like intraoral scanners and 3D printers being easy to own and maintain and increased availability of biocompatible 3D printing materials orthodontist are curious to use this technology to improve orthodontic bracket positioning which would require minimal to no repositioning during the course of treatment. The authors here have tried to outline 2 different methods using CBCT and VTO as guide to decide the bracket positioning digitally and using 3D printed Indirect Bonding trays for orthodontic bonding.

Publisher

Scientific Scholar

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5. Measurement and comparison of bracket transfer accuracy of Measurement and comparison of bracket transfer accuracy of five indirect bonding techniques;Castilla;Angle Orthod,2014

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