Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems-Reference-Cited by-同舟云学术

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Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems

Published:2015-02-27 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Smart Photonic and Optoelectronic Integrated Circuits XVII
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Author:

Wang Yixiao,Akin Meriem,Jogschies Lisa,Overmeyer Ludger,Rissing Lutz

Publisher

SPIE

Reference29 articles.

1. Optoelectronic devices & their applications;Kumar,2003

2. Optoelectronic Integrated Circuit Design and Device Modeling;Gao,2011

3. Silicon Optoelectronic Integrated Circuits

4. A review of flexible circuit technology and its applications;Macleod,2002

5. Flexible Circuit Technology;Fjelstad,2007

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design und Simulation einer planaren GRIN Linse zur Kopplung von Licht in einen Wellenleiter;Konstruktion für die Additive Fertigung 2018;2019-12-01

2. Chip-on-Flex Packaging of Optoelectronic Devices in Polymer-Based Planar Optical Interconnects;IEEE Journal of Selected Topics in Quantum Electronics;2018-11

3. Chip-Level Packaging of Edge-Emitting Laser Diodes Onto Low-Cost Transparent Polymer Substrates Using Optodic Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-05

4. Simulative Investigations of the Mechanical Reliability of the Flexible Optoelectronic Packaging Using Optodic Bonding;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05

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