Two microthermal shear stress sensors: surface micromachined and bulk-bonding micromachined

Author:

Shi Shali

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. F. Jiang, Y. Xu, T. Weng, Z. Han, Y. Tai, A. Hwang, C. Ho, and S. Newbern , “Flexible shear stress sensor skin for aerodynamics applications,”Proc. IEEE 13th Intl. Conf. Micro Electro Mechanical Syst. (MEMS 2000), Miyazaki, Japan, Jan. 2000, pp. 364–369, IEEE (2000).

2. J. H. Haritonidis , “The measurement of wall shear stress,” inAdvances in Fluid Mechanics Measurements, pp. 229–261, Springer-Verlag, New York (1989).

3. R. J. Goldstein ,Fluid Mechanics Measurements, Hemisphere, Washington, DC (1983).

4. IC-integrated flexible shear-stress sensor skin

5. Y. Xu, F. Jiang, Q. Lin, J. Clendenen, S. Tung, and Y. C. Tai , “Underwater shear-stress sensor,”Proc. IEEE 15th Intl. Conf. Micro Electro Mechanical Systems (MEMS 2002), Las Vegas, NV, 20–24 January 2002, pp. 340–343, IEEE, Piscataway, NJ (2002).

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