Author:
Lee Jong-Gu,Kim Hyeon-Jin,Kim JinMan,Kim HongJu,Heo Seok,Ko Haram,Jeon SungBin,Kim Young Ha,Hong Jinhong,Kang Hyunjae,Kim Jeong-Gil
Reference8 articles.
1. Direct silicon bonding dynamics: A coupled fluid/structure analysis
2. Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect;Theil,2019
3. ST Micro Studies Hybrid Bonding Reliability;Garrou,2019
4. CF/ML shift optimization for small pixel CMOS image sensor through FDTD simulation;Kuo,2010