Modeling and characterization of optical TSVs-Reference-Cited by-同舟云学术

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Modeling and characterization of optical TSVs

Published:2017-02-10 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Optical Fibers and Their Applications 2017
language:
Short-container-title:

Author:

Neumann Niels¹,Charania Sujay¹,Killge Sebastian¹,al-Husseini Zaid¹,Henker Ronny¹,Ellinger Frank¹,Bartha Johann¹,Plettemeier Dirk¹

Affiliation:

1. TU Dresden (Germany)

Publisher

SPIE

Reference17 articles.

1. Recent advances and new trends in nanotechnology and 3D integration for semiconductor industry;Lau,2011

2. TSV technology for 2.5D IC solution;Wang,2012

3. Development of super thin TSV PoP;Carson,2010

4. Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA;Banijamali,2011

5. Addressing bandwidth challenges in next generation high performance network systems with 3D IC integration;Li,2012

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simulation research of high-efficiency unidirectional vertical coupling grating couplers for optical through-silicon vias in 3D optoelectronic integrated circuits;Optics Communications;2021-01

2. Design, Fabrication, and Comparison of 3D Multimode Optical Interconnects on Silicon Interposer;Journal of Lightwave Technology;2020-07-01

3. Micro structured coupling elements for 3D silicon optical interposer;SPIE Proceedings;2017-05-17

4. Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacks;SPIE Proceedings;2017-05-16

5. 3D Optical Coupling Techniques on Polymer Waveguides for Wafer and Board Level Integration;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

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