Toward 0.1-μm contact hole process by using water-soluble organic overcoating material (WASOOM)-- Resist flow technology III: study on WASOOM, top flare, and etch characterization
Author:
Chun Jun-Sung,Maeng Chang H.,Tesauro Mark R.,Sturtevant John L.,Oberlander Joseph E.,Romano Andrew R.,Sagan John P.,Dammel Ralph R.