1. The study of the resin-bond diamond wheel for IC silicon wafer nanoscale roughness back grinding;Li,2011
2. Research on soft abrasive wheel for ultra-precision grinding of silicon wafer;Sang,2009
3. Research on microstructure large-scale characterization method based on white light scanning interferometry;Chang,2009
4. Research on white light scanning interferometry method and system;Long,2011
5. Experimental study on the white light interference fringes of Michelson interferometer;Wu;Journal of Logistical Engineering University,2012