Measurement of elastic and thermal properties of composite materials using digital speckle pattern interferometry-Reference-Cited by-同舟云学术

Measurement of elastic and thermal properties of composite materials using digital speckle pattern interferometry

Published:2015-08-24 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Kumar Manoj,Khan Gufran S.,Shakher Chandra

Publisher

SPIE

Reference20 articles.

1. Dynamics of Multilayered Composite Plates With Shape Memory Alloy Wires

2. Kumar, M., Gaur, K. K. and Shakher, C., “Measurement of material constants (Young’s modulus and Poisson ratio) of polypropylene using digital speckle pattern interferometry (DSPI),” Special Issue of J Jpn Soc. Exp. Mech. (in Press).

3. Application of plate vibration and DSPI in evaluation of elastic modulus;Kumar,2008

4. Vibration measurement by the time-averaged electronic speckle pattern interferometry methods

5. A procedure for calculating through laser speckle interferometry the elastic constants of isotropic materials

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