Author:
Chae Soo Doo,Moriya Tsuyoshi,Tsujikawa Shimpei,Imai Kiyotaka,Liu Eric,Ko Akiteru,Biolsi Peter,Kagaya Munehito,Lee Choongman,Okubo Kazuya,Hsieh Chia-Yun,Suzuki Yusuke
Reference5 articles.
1. Cramming more components onto integrated circuits;Moore,1998
2. High index 193 nm immersion lithography: the beginning or the end of the road
3. International Technology Roadmap for Semiconductors (ITRS) Metrology Report (2015) http://www.itrs2.net/itrs-reports.html
4. Roughness and uniformity improvements on self-aligned quadruple patterning technique for 10nm node and beyond by wafer stress engineering;Liu,2017
5. Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme;Mohanty,2015