1. Peter Weidner, Alexander Kasic, Thomas Hingst, Thomas Lindner, “Deep Trench Metrology Challenges for 75nm DRAM Technology,” FabTech White Paper, http://www.fabtech.org/white_papers/_a/deep_trench_metrology_challenges_for_75nm_dram_technology/#.
2. Mason Duan, et al., “Metrology of micro-step height structures using 3D scatterometry in 4xnm advanced DRAM,” Metrology, Inspection, and Process Control for Microlithography XXV, edited by Christopher J. Raymond, Proc. of SPIE Vol. 7971, 79712J.
3. Metrology of deep trench structures in DRAM using FTIR reflectance spectrum;Zhang,2009
4. CD SEM metrology macro CD technology: beyond the average;Bunday,2005
5. SEM Simulation for 2D and 3D Inspection Metrology and Defect Review;Schwarzband,2014