Measuring after etch overlay and characterizing tilt fingerprints in multi-tier 3D-NAND structures-Reference-Cited by-同舟云学术

Measuring after etch overlay and characterizing tilt fingerprints in multi-tier 3D-NAND structures

Published:2019-03-26 Issue: Volume: Page:
ISSN:
Container-title:Metrology, Inspection, and Process Control for Microlithography XXXIII
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Author:

Lee Honggoo,Lee Dong-Young,Kim Jun-Yeob,Han Sangjun,Park Chan-Ha,Karssenberg Jaap,Shahrjerdy Mir,van Leest Arno,Oh Nang-Lyeom,Lee Dong-Hak,Soco Aileen,Nooitgedagt Tjitte

Publisher

SPIE

Reference2 articles.

1. Unique method for controlling device level overlay with high NA optical overlay technique using YieldStar in a DRAM HVM environment;Dong-Kiu,2018

2. Enabling optical metrology on small 5x5um2 in-cell targets to enabe flexible sampling and higher order overlay control for advanced Logic devices;Antonio,2018

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3. GAGAN: Global Attention Generative Adversarial Networks for Semiconductor Advanced Process Control;IEEE Transactions on Semiconductor Manufacturing;2023

4. Overlay control solution for high aspect ratio etch process induced overlay error;Journal of Vacuum Science & Technology B;2022-07

5. Plasma sheath modelling to predict etch-induced overlay;Journal of Physics D: Applied Physics;2021-11-09