Three-dimensional surface inspection for semiconductor components with fringe projection profilometry-Reference-Cited by-同舟云学术

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Three-dimensional surface inspection for semiconductor components with fringe projection profilometry

Published:2016-11-24 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Deng Fuqin¹,Ding Yi²,Peng Kai³,Xi Jiangtao⁴,Yin Yongkai⁵,Zhu Ziqi⁶

Affiliation:

1. Harbin Institute of Technology (China)

2. Hauzhong Univ. of Science and Technology (China)

3. Huazhong Univ. of Science and Technology (China)

4. Univ. of Wollongong (Australia)

5. Shandong Univ. (China)

6. Wuhan Univ. of Science and Technology (China)

Publisher

SPIE

Reference20 articles.

1. Range imaging with adaptive color structured light

2. A three-dimensional imaging system for surface profilometry of moving objects

3. Overview of three-dimensional shape measurement using optical methods

4. Optical Measurement of Surface Topography, 1st. Edition;Leach,2011

5. Laser triangulation: fundamental uncertainty in distance measurement

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of measuring accuracy for planar and non-planar scenes in photogrammetry;Fourteenth International Conference on Graphics and Image Processing (ICGIP 2022);2023-06-27

2. Breast surface coordinate variation analysis caused by round shape tumor with fringe projection profilometry;Smart Biomedical and Physiological Sensor Technology XV;2018-05-14

3. In-line inspection of surface feature and defect;Microsystem Technologies;2017-12-18

4. Visual Inspection by Capturing a Rotating Industrial Part;Journal of the Japan Society for Precision Engineering;2017

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