The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography-Reference-Cited by-同舟云学术

The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography

Published:2015-07-29 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Thong-on T.,Prakobsang T.,Pethsanthad W.,Boonsri C.,Plaipichit S.,Buranasiri P.,Yoshimori K.

Publisher

SPIE

Reference16 articles.

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